This booklet introduces microelectromechanical platforms (MEMS) packaging using polymers or skinny motion pictures – a brand new and certain packaging know-how. It first investigates the connection among utilized load and establishing displacement as a functionality of benzocyclobutene (BCB) cap measurement to discover the debonding habit, after which provides BCB cap deformation and pressure improvement at assorted establishing displacements as a functionality of BCB thickness, that's a criterion for BCB cap move failure.
Transfer packaging recommendations are attracting expanding curiosity simply because they bring packaging caps, from provider wafers to equipment wafers, and reduce the fabrication concerns often encountered in thin-film or polymer cap encapsulation. The publication describes very-low-loss polymer cap or thin-film-transfer options in accordance with anti-adhesion coating equipment for radio frequency (RF) (-MEMS) machine packaging. because the polymer caps are at risk of deformation as a result of their fairly low mechanical stiffness in the course of debonding of the provider wafer, the e-book develops a suitable finite aspect version (FEM) to simulate the debonding strategy taking place within the interface among Si service wafer and BCB cap. finally, it contains the load–displacement curve of alternative fabrics and provides a versatile polymer clear out and a tunable clear out as examples of the functions of the proposed technology.
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Extra resources for Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface ... (Springer Series in Advanced Manufacturing)
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface ... (Springer Series in Advanced Manufacturing)